Semiconductor/Display – G-FAM Co., Ltd

Pellicle case for semiconductor photolithography. ABS compound – GFASTAT EA07-T1.

Wafer ring for semiconductor etching process. PC compound – GFASTAT CO21-C27T.

PCB case for semiconductor packaging. ABS compound – GFASTAT EA07-A20.

Storage box for semiconductor EDS testing. PBT compound – GFASTAT CR20-C28.

500mm FOUP for semiconductor metal interconnect process. PC compound – GFASTAT CO21-C85F.

300mm FOUP for semiconductor metal interconnect process. PC compound – GFASTAT CO21-C27T.

Wafer jar box for semiconductor deposition and ion implantation. PP compound – GFASTAT CO25-P2.

FOUP tray for semiconductor deposition and ion implantation. PPA compound – GFASTAT CR38-C4.